Mobile devices such as smartphones, tablets, and laptops have become essential tools in our daily lives. However, as these devices become more powerful, they also generate more heat. Most mobile phones and tablets rely on passive cooling methods to dissipate heat, which can lead to discomfort for users as the heat is transferred to the body of the device and eventually to their palms. An active cooling fan would be a more effective solution, but conventional fans are too large to fit in these compact devices.
Microspeaker manufacturer xMEMS believes they have found the solution with the XMC-2400, the world’s first all-silicon fan-on-a-chip. This innovative design, which is roughly a millimeter thick and less than a centimeter wide and deep, draws on xMEMS‘ expertise in audio products. Mike Housholder, vice president at xMEMS, explains, „The industry has a stream of technologies that moved from a mechanical device into silicon. Now just as we’ve taken the century-old speaker and moved it to silicon, we’re doing the same for the fan.“
The XMC-2400 is a result of xMEMS‘ work in all-silicon microspeakers, such as those found in earbuds like the Creative Aurvana Ace and Noble Audio XM-1. The fan uses piezoelectric materials that change shape when an electrical charge is applied. It features a hollow cavity with cantilever vents on the top and a valve on the bottom. By opening the vents with the valve closed, suction is created, building air pressure in the cavity, which is then released when the bottom valve opens.
While the volume of air moved by the XMC-2400 is relatively small compared to other cooling solutions, the fan can move up to 39 cubic centimeters of air per second. This is achieved through rapid repetition of the airflow process, making it an effective cooling solution for mobile devices. The XMC-2400 is produced at a chip fab on 8-inch silicon wafers, with supply partners including TSMC and Bosch.
One of the key advantages of the XMC-2400 is its potential to improve the cooling of mobile devices without compromising on size, weight, or durability. xMEMS plans to work with partners to integrate the chip in various ways, such as a „lid-to-lid“ mount directly on top of a mobile system-on-chip (SoC) or placed beside the SoC to minimize a device’s overall thickness. This flexibility in placement allows for efficient cooling by either venting air away from the SoC or pulling air across it.
With the trend of devices becoming thinner, thermal management remains a significant challenge for manufacturers. The XMC-2400 could address this issue and prevent throttling, which has been a concern for device makers. As on-device AI features become more prevalent, the demand for effective cooling solutions will only increase. The XMC-2400 has the potential to be the first in a line of similar fans, with the ability to combine chips into a fan array for more demanding devices.
In conclusion, xMEMS‘ XMC-2400 represents a significant advancement in cooling technology for mobile devices. By leveraging their expertise in all-silicon microspeakers, xMEMS has developed a compact and efficient fan-on-a-chip that could revolutionize thermal management in smartphones, tablets, and laptops. As the demand for powerful yet slim devices continues to grow, innovative solutions like the XMC-2400 will play a crucial role in ensuring optimal performance and user experience.