In today’s rapidly advancing technological landscape, the need for radiation-hardened microelectronics components for space applications has never been more crucial. The U.S. military is at the forefront of boosting the defense industry’s ability to integrate these specialized components, which are essential for spacecraft operating in high-radiation space environments and mission-critical military applications.
The U.S. Naval Surface Warfare Center in Crane, Ind., recently announced a significant $25.8 million order to Honeywell International Inc. in Minneapolis to support the nation’s strategic radiation-hardened microelectronics facility and production capability. Honeywell Aerospace operates two state-of-the-art radiation-hardened microelectronics manufacturing facilities in Plymouth, Minn., and Clearwater, Fla., which are among the few remaining facilities in the U.S. capable of producing components that can withstand radiation doses exceeding 1 megarad.
This order tasks Honeywell with sustaining their strategic radiation-hardened microelectronics capability through various research and development efforts. This includes researching extensions of existing products and technology, radiation testing and analysis, and sustaining existing application-specific integrated circuit (ASIC) product support and multi-project wafer test and modeling capability. These services are crucial for maintaining a domestic trusted source for strategic radiation-hardened microelectronics to meet the certification requirements set by the U.S. Department of Defense.
Radiation-hardened microelectronics components play a vital role in ensuring the success of manned and unmanned spacecraft on long-duration orbital missions in high-radiation space environments such as geosynchronous orbits. Additionally, these components are essential for mission-critical military applications like ships, aircraft, and land vehicles that may need to operate through the effects of nuclear explosions.
While there are several microelectronics designers capable of producing components suitable for some spacecraft, there are few companies left with the expertise to produce components that can withstand long-duration exposure to intense radiation or weapons-grade radiation. Honeywell’s expertise in this area makes them a key player in ensuring the reliability and functionality of these critical components.
The work on this order will be conducted in Plymouth and Minneapolis, Minn., and is expected to be completed by December 2027. For more information on Honeywell’s radiation-hardened microelectronics capabilities, interested parties can visit their website. Those looking to learn more about the Naval Surface Warfare Center-Crane can visit their website as well.
In conclusion, the collaboration between the U.S. military and industry leaders like Honeywell is essential for advancing the development and integration of radiation-hardened microelectronics components for space applications. These components are crucial for ensuring the success of space missions and maintaining the functionality of mission-critical military applications in challenging environments. By investing in these capabilities, the U.S. military is strengthening its defense industry and ensuring the reliability of its technological infrastructure for years to come.